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Design Guide Provides Useful Information on Wire Bonding

Natel Engineering Co., a leading manufacturer of high-end microelectronic modules and hybrids for a wide range of industries,
announces the release of a new design guide on understanding wire bonding in microelectronic design. This new guide provides a series of rules that, if implemented prior to layout, help microelectronic designers stay within the wire bond limits, thus achieving lower costs and higher throughput, reliability, and yields. Implementing these rules will decrease time-to-market and time-to-volume. In addition, these guidelines contribute to more efficient design, prototype, and production stages.

As one in a series of design guides available from Natel, this new Wire Bonding design guide provides easy access to valuable process design information with a quick reference format. A complete list of special layout considerations, including wire length and loop height, and drawings of the effects on wire bond scrub direction and obstacle spacing are highlighted.
Natel is a valuable resource for companies seeking high-end microelectronic manufacturing solutions. The design guide series is one of the many tools that Natel provides to help companies enhance their design and manufacturing processes.
For over 25 years, Natel has been a premier provider of quality hybrids, MCMs, COBs, and other modules, including 10G – 40G high frequency products. Natel meets the microelectronic needs of many industries including defense, medical, microwave/RF, ATE, and opto-electronic. With advanced production capabilities, Natel offers lower costs and faster time-to-market, providing effective microelectronic manufacturing solutions. To learn how Natel can eliminate your manufacturing concerns, contact Natel Engineering Co., Inc., at 9340 Owensmouth Ave., Chatsworth, CA 91311; tel: (800) 590-5774; fax: (800) 590-5764; email:; or visit the web at
Jim Angeloni
VP, Manufacturing Services
Phone: (818) 734-6553
Fax: (818) 734-6530

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