- Markets Served
- Engineering Services
- Electronic Manufacturing
- Microelectronics Services
- NeoTech Interconnect
- About NeoTech
NEO Tech has emerged as North America’s leading manufacturer of quality low-temperature co-fired ceramic (LTCC) and high-temperature co-fired (HTCC) substrates and packages. These fabrication technologies provide unique solutions for high interconnect density, compact networks and high-frequency applications. Our ceramic substrate facilities also produce both thin and thick film parts for a wide variety of OEMs in medical, telecommunications, and defense markets.
Ceramic Substrate manufacturing includes:
LTCC and HTCC technology as a unique solution for high-interconnect density and compact networks, and high frequency applications. Key advantages include:
NEO Tech offers standard Thick Film Substrates used in most signal and low power applications. We work with a variety of substrates including BeO, AlN and Alumina (Al2O3).
NEO Tech also provides next generation Etch Conductor Photolithography (ECP) Thick Film Substrates suitable for microwave and high-resolution lines and space applications. The Thick Film conductor material is fired in a dense, non-porous film over a large area of the substrate. The high resolution lines are then defined using photoresist and etch techniques to achieve widths and spaces as low as 0.003″ (0.0762mm). The ECP process is based around standard thick film Au that is already qualified by many OEMs, thus avoiding long qualification cycles and bringing customers to market quickly. ECP technology allows designers to combine RF and digital functions on substrates, and offers options for integrating capacitors, resistors, inductors, couplers, and filters. Capacitors and resistors can be laser trimmed to obtain +/-3% and +/-1% tolerances, respectively.
Co-Fired Ceramic : LTCC & HTCC
Tour our Carlsbad Plant
“Raytheon is very pleased with NEO Tech and we are
NOT easy to please”
"Collaboration, communication and cooperation
trump lowest price"
"It was like having an internal manufacturing operation
without the overhead"
"The middle ground is a little hard to identify, and we needed to find someone flexible enough to play both games"