NEOTech has long been recognized as a premier EMS provider for highly complex, high-reliability electronics — and with the recent implementation of an advanced wire bonding process for microelectronics, we’re once again setting a new standard in manufacturing excellence.
This upgraded process, built around the Standoff Stitch (SOS) bonding method, dramatically increases production yield and reduces cycle time — with results that include a jump from 99.3% to 99.99% in yield and doubled throughput. But at NEOTech, this is more than a process upgrade. It reflects our continuous pursuit of quality, our passion for solving complex challenges, and our drive to deliver customer excellence at every level of manufacturing.
Our customers depend on NEOTech for more than precision-built products — they rely on us for partnership, responsiveness, and trusted solutions. 
The SOS wire bonding process is one of many ways we deliver on that promise. Unlike other common methods that add complexity and time, this technique optimizes both reliability and speed by accommodating substrate surface irregularities with a gold ball bonding interface — no additional steps required.
The result? Improved bond strength, faster assembly times, and consistent reliability for microelectronics used in demanding applications like implantable medical devices, aerospace systems, and defense electronics.
“Implementing SOS wire bonding has been a major leap forward for our microelectronics manufacturing,” explains Jim Doyle, CEO of NEOTech’s Aerospace & Defense division. “This improvement supports the reliability and long-term performance of the products we build — and that’s what truly matters in aerospace, defense, medical, and high-tech industrial sectors.”
Our customers know that we’re not just a supplier — we’re a partner who takes ownership of their success. With every improvement, we look for ways to better serve our OEM partners through enhanced efficiency, technical innovation, and a deep-rooted commitment to quality. That commitment is backed by globally recognized certifications including ISO 9001:2015, ISO 13485:2016, and AS9100, and is proven across thousands of high-reliability builds over four decades of service.
The significance of NEOTech’s SOS wire bonding process has not gone unnoticed. It was recently featured in SMT Today, one of the most respected publications in the electronics manufacturing industry.
Read the coverage in SMT Today Magazine → View the issue online
From early-stage design collaboration to full-scale production, NEOTech provides solutions tailored to your exact requirements. We specialize in overcoming the toughest challenges and optimizing product manufacturability without sacrificing quality or performance.
With over 40 years of experience in aerospace/defense, medical device, and high-tech industrial markets, NEOTech remains a manufacturing partner trusted by the world’s leading OEMs — because we never stop innovating on your behalf.
Explore how NEOTech’s microelectronics capabilities can support your next program.
Steve Bates, NEOTech Marketing Manager – May 2025
With more than forty years of expertise in high-reliability hybrid and RF technologies, NEOTech has established itself as the largest provider of microelectronics assembly services in North America. We offer a comprehensive array of services encompassing the design, development, and manufacturing of microelectronic assemblies, specializing in microwave electronics and circuits. Our dedicated teams are committed to delivering technical support and advanced testing ensuring superior quality and reliability for our customers.
Visit our Microelectronics Services page for more information about our capabilities.
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Please feel free to access NEOTech’s design guides for detailed specifications to optimize your design.
