Test Engineering

Test Engineering / Test Development

Our test development team has designed test stations and test specifications for parts in the DC range up to 67 GHz. Our test engineering team ensures that quality requirements are met through a wide range of problem solving techniques. Together, NEO Tech engineers work to embed Design For Test thinking to minimize capital and resource investment for mass manufacturing.

NEO Tech test strategy—Ensure the appropriate level of testing is performed at the earliest stage in the Process to reduce cost through early defect detection.

  • Functional test development
  • PCBA functional testing within ICT
  • Boundary Scan
  • Simple to fully automated testing of PCBA and finished products
  • Testing of microelectronic devices

Variety of test platforms including:

  • Full Turnkey In-Circuit Test (ICT) development
  • Flying Probe Test
  • System Verification Test (SVT) development
  • Functional Verification Test (FVT) development
  • Automated Optical Inspection (AOI)
  • Automated X-ray Inspection (AXI) and real-time x-ray analysis
  • RF testing including frequency calibration, PAM/FSK/PWM, GPS, Pager, WiFi, 802.11B,D

Extension of customer’s test department for test integration and development:

  • Development and utilization of automated and semi-automated test solutions
  • Design and assemble test stations and fixtures
  • Reverse engineer test systems
  • Test coverage mapping to ensure conformance to NEO Tech’s model to ensure delivered quality
  • Management of third-party test developers and fixture suppliers
  • Integration of customer-supplied test platforms for volume production

    Development of tests for environmental and performance robustness using the following test methods: 

    • Burn-in
    • Liquid Burn-in
    • Temperature Cycle
    • Mechanical Shock
    • Constant Acceleration
    • Gross and Fine Leak
    • Krypton Leak
    • Environmental Stress Screening (ESS) processes to uncover latent failures and guide DFM/DFT processes