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System Integration and Test

Box Build, Systems Integration and Test

NEO Tech’s test engineering expertise ensures that every complex customer quality requirement is met. Our employees are incentivized around consistent defect reduction, and test is a critical component to understanding root causes of defects. Lean discipline in test design and implementation reduces cost and WIP. Robust processes and flexible systems ensure rapid test development cycles. We test components, microelectronics, PCBAs, boxes, and cable assemblies to numerous ISO, MIL-STD, and customer requirements. We either custom design test equipment and software or use test equipment and software provided by our customers.

  • Electronic / Electromechanical
  • Variety of enclosure (sheet metal / cast / plastic)
  • Power control and power conversion
  • Precision mechanical
  • Motion control
  • Vacuum and hydraulics sub-systems
  • RF technology
  • Optics and video projection
  • L.E.D and Plasma

NEO Tech offers complete functional test for variety of electronic products, systems and devices. Our functional test services validate that products perform in accordance with customer expectations before delivery to the end-user.

Our test services offer all types of functional testing, ranging from Burn-in test, standard test systems, PC-test systems and custom designed test systems with a range of automation aligned with the throughput required of the manufacturing process. All of the test results are captured so that you can always track individual test results to specific devices.

NEO Tech  can develop specific automated test systems for our customers, through our engineering services that deliver competitive and efficient performance.

Electrical Testing

  • RF & Microwave Testing
  • RF Probe
  • IC Programing and Validation
  • In-Circuit Test (ICT)
  • Flying Probe Test
  • ATE Final Test
  • CFE / GFE Functional Test
  • Life Test

Mechanical Stress Testing and Physical Inspection

  • Optical Inspection/Microscopy up to 1000X
  • Automated Optical Inspection (AOI)
  • Real-Time and In-Line X-Ray Inspection
  • X-Ray Fluorescence (XRF)
  • C-mode Scanning Acoustic Microscopy (CSAM/Sonoscan)
  • Cross-Sectioning
  • Decapsulation
  • Wire Pull & Die Shear
  • Mechanical Shock
  • Particle Impact Noise Detection (PIND)

Environmental Screening & Stress Testing

  • Burn-in
  • Liquid Burn-in
  • Temperature Cycle
  • Mechanical Shock
  • Constant Acceleration Test
  • Gross and Fine Leak
  • Krypton-85 Leak

MIL-STD-883 and MIL-STD-750 Testing

  • Internal Examination/Inspection
  • Particle Impact Noise Detection (PIND)
  • Die Shear Grams of Force
  • Bond Strength Grams of Force
  • Destructive Bond Pull and Die Shear
  • Fine Leak Testing Leak Rate
  • Gross Leak Testing Examination/Inspection
  • Krypton-85 Leak Testing
  • Radiographic Examination/Inspection
  • Exposure/Temperature Cycling
  • Curve Trace
  • SEM Analysis

“Raytheon is very pleased with NEO Tech and we are
NOT easy to please”

 Chairman and former CEO, Raytheon

"Collaboration, communication and cooperation
trump lowest price"

COO, Oraya

"It was like having an internal manufacturing operation
without the overhead"

President and CEO, Oraya

"The middle ground is a little hard to identify, and we needed to find someone flexible enough to play both games"

President and CEO, Oraya